Solution for Aluminum Base Copper Clad Laminate Press
copper clad laminates press, ccl production system, ccl trimmer, ccl stacking and inspection system, fiber glass impregnation, fiber glass epoxy impregnation,
# A Complete Set of Solution for Aluminum Base Copper Clad Laminate Press
Basic Structure
Instruction
Circuit Layer: Electrolysis copper foil
Thermal Conductive Dielectric Layer: This offers electrical isolation with minimum thermal resistance. Two types: Fiberglass support& non-fiberglass support.
Aluminum Substrate: It supports the entire structure and conducts the heat. The material is aluminum alloy plate.
Single Al-Substrate CCL
Single Al-Substrate CCL offers various kinds of aluminum alloy plate, copper foil and dielectric layers to meet the general requirement of single-layer thermally conductive printed circuit board.
Double Al-Substrate CCL
